Page 69 - ESDMAN CO., LTD.

ESD Tapes

High Temperature Masking Dot

Product Description
High temperature masking dot is a polyimide film-backed silicone adhesive tape with high temperature resistant.

Product Construction Application
Backing: Polyimide Mask for printed circuit boards (PCB) during wave solder or
Adhesive solder dip process
Color: Amber

Technical Data
Product Units Test values Test method
Backing Thickness mm 0.025
Total Tape Thickness mm 0.075±0.005
Peeling Strength N/25mm 6~8 GB-T2972-98
Tensile Strength at Break KN/M >3.5 GB-T7753-87
Elongation at Break % >40 GB-T7753-87
Temperature resistance °C 280
Dielectric Strength volts >5000 GB/T7752-87
Chemical Resistance - Good 20%HCI,NaOH/5Hrs

Storage Details
Store under normal conditions of 10° to 30°C and 40 to70% R.H. in their initial packaging.
Shelf life is 12months from the date of manufacture.

Remark
The above technical parameters established in our experimental data, may be due to the different usage and experience vary, so we
suggested to do a test before using.

High Temperature Masking Tape

33mm(36 yards) High Temperature Masking Tape consists of a polyimide film and silicone adhesive designed for high temperature
masking applications, including the protection of printed circuit board gold finger contacts during wave soldering.
Specification

Testing Item Testing Result
Backing Polyimide film
Adhesive Silicone
Film Thickness(mm) 0.025mm
Total Thickness(mm) 0.058mm(±0.003mm)
Length 33m (36 yards)
Width(mm) 500mm
Adhesion to Steel(KG/25mm) 0.45-0.55
Tensile Strength(KG/25mm) 10-13
Elongation at Break(%) ≥60
Voltage Resistance(KV) 3
Temperature Resistance(°C) 260

66